
New Metal Lift-Off Tool Designed for the GaAs market Add Cost Effective, Reliable Production Capacity.
Soak 5 wafers, face-up, in a heated immersion chamber that combines gentle rotation and recirculation across the face of the wafer.
Advantages: rotation and direct re-circulation create opportunities for faster, uniform soaks and higher yield & throughput.

The high pressure chamber introduces a focused stream of solvent or water to remove the metal and softened photoresist.
Advantage: wafer position face-down minimizes particles and fall-back of metal lift-off debris.
A metal recovery system captures large quantities of metal or sludge and provides easy access for cleaning.
Advantages: high uptimes, less intervention and easier metal recovery